On October 27, 2026, Valahia University of Târgoviște will host the 5th edition of the IEEE EPS & NTC Student Branch Chapters Summit, a meeting dedicated to students, to be held at the Institute of Multidisciplinary Research for Science and Technology (ICSTM) as part of the 32nd IEEE International Symposium for Design and Technology in Electronics Packaging (SIITME 2026).
The Summit has two important goals: to present students some of the latest trends in electronics packaging and to give them the opportunity to get to know each other and initiate future collaborations.
This year’s edition brings together students from IEEE EPS and NTC Student Branch Chapters from Bulgaria, Hungary, and Romania, giving their representatives a valuable opportunity to connect, exchange experiences, and build lasting relationships. It also offers participants the chance to explore the latest trends in electronics packaging and nanotechnology through lectures delivered by experts actively involved in these fields.
Hosted by ICSTM, the Summit brings the regional IEEE student community to Târgoviște and offers students of Valahia University, including members of the university’s IEEE EPS Student Branch Chapter, direct contact with peers, researchers, and industry representatives.
The preliminary programme is available on the conference website, siitme.ro, and free registration is open on IEEE vTools: events.vtools.ieee.org/m/583407.
